Phase change materials (PCMs) are able to absorb, store and release large amounts of latent heat over a defined temperature range when the material changes phase or state. They are highly used in thermal energy storage as well as the thermal management of electronic devices. However, a key limitation associated with the PCMs is their low thermal conductivity, which delays PCM response to thermal transients. To overcome this limitation, researchers have sought to couple PCM with thermal conductivity enhancers such as metal foam, metal mesh, and nanoparticles.

The aim of this Special Issue is to collect original research articles on the most recent analytical, numerical, and experimental research in this field, in order to provide guidelines for future research directions. Potential topics include, but are not limited to: Couple PCM with thermal conductivity enhancers; PCM-equipped heat transfer devices.